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The following specifications show the external lead-free processes by each main package.
The lead-free specification differs according to each product.

Surface-mount type (SMD)

Package Lead-free specification
Name Appearance Sn-Bi
plating
Sn
plating
Sn-Cu
plating
Ni/Pd/Au
plating
Sn-Cu
dip
Sn-Ag-Cu
balls
Ni/Au
plating
Au
plating
IC, LSI QFP
TQFP
LQFP
HQFP
QFP check check check check        
SOP
TSOP (1)
TSOP (2)
TSSOP
HSOP
SOP check check check check        
SOJ
QFJ
SOJ check   check          
QFN - check check check check        
BGA
TFBGA
HBGA
BGA           check    
LGA LGA             check  
Discrete Mini-mold Mini-mold check check            
UPAK
DPAK(S)
LDPAK(S)
MPAK
UPAK check              
LFPAK
WPAK
LFPAK   check   check        
URP
UFP
URP check              
Module type (MCM)
Ceramic type package
Module type (MCM)
Ceramic type package
              check
Hollow plastic mold Hollow plastic mold             check  

: Lead-free specification

Through-hole type (THD)

Package Lead-free specification
Name Appearance Sn-Bi
plating
Sn
plating
Sn-Cu
plating
Ni/Pd/Au
plating
Sn-Cu
dip
Sn-Ag-Cu
dip
IC, LSI DIP
SDIP
DIP check check check check check  
ZIP ZIP check   check      
Discrete Radial type
(transistors)
Radial type (transistors) check check       check
TO-92
TO-220
TO-3P
TO-92         check check
TO-251
TO-262
TO-251 check check        
TO-3PFM
DPAK(L)
LDPAK(L)
DPAK check          
DO-35
MHD
DO-35         check  

: Lead-free specification

Related Information

Package


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