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The following specifications show the external lead-free processes by each main package.
The lead-free specification differs according to each product.

Surface-mount type (SMD)

Package Lead-free specification
Name Appearance Sn-Bi
plating		 Sn
plating		 Sn-Cu
plating		 Ni/Pd/Au
plating		 Sn-Cu
dip		 Sn-Ag-Cu
balls		 Ni/Au
plating		 Au
plating
IC, LSI QFP
TQFP
LQFP
HQFP		 QFP check check check check        
SOP
TSOP (1)
TSOP (2)
TSSOP
HSOP		 SOP check check check check        
SOJ
QFJ		 SOJ check   check          
P-VQFN - check   check check        
BGA
TFBGA
HBGA		 BGA           check    
LGA LGA             check  
Discrete Mini-mold Mini-mold check check            
UPAK
DPAK(S)
LDPAK(S)
MPAK		 UPAK check              
LFPAK
WPAK		 LFPAK       check        
URP
UFP		 URP check              
Module type (MCM)
Ceramic type package		 Module type (MCM)
Ceramic type package		               check
Hollow plastic mold Hollow plastic mold             check  

: Lead-free specification

Through-hole type (THD)

Package Lead-free specification
Name Appearance Sn-Bi
plating		 Sn
plating		 Sn-Cu
plating		 Ni/Pd/Au
plating		 Sn-Cu
dip		 Sn-Ag-Cu
dip
IC, LSI DIP
SDIP		 DIP check check check check check  
ZIP ZIP check   check      
Discrete Radial type
(transistors)		 Radial type (transistors) check check       check
TO-92
TO-220
TO-3P		 TO-92         check check
TO-251
TO-262		 TO-251 check check        
TO-3PFM
DPAK(L)
LDPAK(L)		 DPAK check          
DO-35
MHD		 DO-35         check  

: Lead-free specification

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