Recently, as part of voluntary action plans on their part, we have had an increasing number of customers requesting the reduction of halogen materials included in semiconductor parts.
Currently, many of Renesas Electronics products use a bromine (Br) halogen compound which is not a restricted substance in the EU RoHS directive, as a flame retardant BGA/LGA interposer and package molding compound.

Renesas Electronics has developed packaging technology using molding compounds and interposer which meet halogen free requirements, and has already started to deliver halogen free products.
Renesas Electronics is increasing halogen free products according to the customer's requests.
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