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Products Overview
Microcontrollers (MCU) and Microprocessors (MPU)
- 8, 16-bit Ultra-low-power MCUs
  - RL78
  - 78K
  - R8C
  - Other
- 32-bit CISC MCUs
  - RX
  - Other
- 32-bit RISC MCUs & MPUs
- Secure MCUs
- Capacitive Touch MCUs
- Smart Analog
Power Devices
RF Devices

Smart Society

Network SRAM

Memory

Fast SRAM

Overview
Documentation
Design Support

Technical Update

DOCUMENT TYPE:

ALL (9)
Device (1)
Others (8)

Device(1)

	Document Title	Doc Number (Previous Number)	Issue Date Revision	Classification of Information	Size(KB)	Product Name	Remarks
	Notice about the switch to lead-free parts on SRAMs Renesas is proceeding with the switch from leaded to lead-free parts on all Renesas products in order to discontinue the use of the element of Pb by the end of 2005 which is specified one of the hazardous substances, based on RoHS-compliance. Under this situation, all Renesas SRAM parts is scheduled to switch to lead-free as follows.	TN-PME-A001A/E	May.18.05 Rev.1.0	Package Change	110	List	-

Others(8)

	Document Title	Doc Number (Previous Number)	Issue Date Revision	Classification of Information	Size(KB)	Product Name	Remarks
	Standardization of moisture-proof aluminum bags and addition of drying agent specifications (expansion of target products) Standardization of moisture-proof aluminum bags and addition of drying agent specifications (expansion of target products)	TN-WRP-A015A/E	May.18.12 Rev.1.00	Packing Change	325	List	-
	Change of inner packing label Change of inner packing label	TN-WRP-A014A/E	Jul.13.11 Rev.1.00	Packing Change	344	List	-
	Change with the stable supply of trays Change with the stable supply of trays	TN-WRP-A012A/E	Sep.30.08 Rev.1.00	Packing Change	1129	List	-
	Change of plastic reel of 330mm in diameter for embossed carrier tape (Standardization of plastic reel) Standardization of plastic reel of 330mm in diameter to that complying with the JEITA standards (so-called EIAJ reel).	TN-WRP-A010A/E	Mar.24.08 Rev.1.00	Packing Change	71	List	-
	Change of content printed on the side of inner box We will unify the content printed on the inner box for IC trays for the purpose of standardizing our tray packaging specification.	TN-WRP-A009A/E	Jan.09.08 Rev.1.00	Packing Change	30	List	-
	Addition of Shipping Tray Type for LQFP2020 Packages Tray forming die is added in response to the increasing production of LQFP2020 packages, and for through handling in manufacturing factories, new tray type name is adopted.	TN-WRP-A007A/E	Jun.07.07 Rev.1.00	Packing Change	136	List	-
	Change notice of tray for memory product shipment Tray change for memory product shipment	TN-WME-A001A/E	Apr.06.07 Rev.1.00	Packing Change	148	List	-
	Change of Carrier Tape Material *Change from polyvinyl chloride (PVC) to polystyrene (PS). The career tape material is changed from PVC to PS.	TN-WRP-A005A/E	Jul.05.06 Rev.1.00	Packing Change	32	List	-

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