Semiconductor Package Mount Manual

• Package Items
• Semiconductor Package Mount Manual
  • Table of Contents
  • How to Read This Manual
  • 1. Overview of Soldering Technology
  • 2. Printed Wiring Board Design
  • 3 Mounting Processes
  • 4 Notes on Storage and Mounting
  • 5 Examples of Mounting and Problems
  • 6 Solder Joint Reliability
  • 7 Appendix
• Basic functions
• Package Variations
• Trends and Topics in Package Technology
• Thermal and Electrical Characteristics
• Packing
• Package and Packing Outline
• Links

This online manual describes mounting and handling methods for semiconductor devices with the aim of enabling you to execute skillful mounting while maintaining the high reliability of the products.

Click the link below if using this manual for the first time.

How to Read This Manual

Use the Table of Contents to search for individual items from the contents.

Table of Contents

Semiconductor Package Mount Manual PDF version (5.5MB)

Contents Overview

• 1. Overview of Soldering Technology
  Describes the soldering methods, basic processes, and materials used.
• 2. Printed Wiring Board Design
  Describes how to calculate the mounting pad dimensions and pin hole diameter.
• 3. Mounting Processes
  Describes the heat resistance and solderability of packages and the soldering conditions used at Renesas Electronics.
• 4. Notes on Storage and Mounting
  Details points to be noted when executing mixed mounting and reflow + flow processing.
• 5. Examples of Mounting and Problems
  Details cases of BGA mounting and the problems that can occur, as well as examples of counter-measures.
• 6. Solder Joint Reliability
  Shows the verified solder joint reliability from various experimental results.
• 7. Appendix
  Describes various additional items related to packages.