This online manual describes mounting and handling methods for semiconductor devices with the aim of enabling you to execute skillful mounting while maintaining the high reliability of the products.
Click the link below if using this manual for the first time.
Use the Table of Contents to search for individual items from the contents.
- 1. Overview of Soldering Technology
Describes the soldering methods, basic processes, and materials used.
- 2. Printed Wiring Board Design
Describes how to calculate the mounting pad dimensions and pin hole diameter.
- 3. Mounting Processes
Describes the heat resistance and solderability of packages and the soldering conditions used at Renesas Electronics.
- 4. Notes on Storage and Mounting
Details points to be noted when executing mixed mounting and reflow + flow processing.
- 5. Examples of Mounting and Problems
Details cases of BGA mounting and the problems that can occur, as well as examples of counter-measures.
- 6. Solder Joint Reliability
Shows the verified solder joint reliability from various experimental results.
- 7. Appendix
Describes various additional items related to packages.